Leadmicro offers diffusion furnace systems configured for boron diffusion with oxidation, annealing, and POCl diffusion applications
All systems feature 6 process tubes, horizontal wafer handling, and air- and water-cooled operation for wafers up to 230 mm
The POCl diffusion version achieves throughputs up to 6,060 M10 or 5,300 G12 wafers per hour, with uptime up to 98% and mechanical yields of 98% to 99%
Diffusion furnaces continue to evolve with enhanced process flexibility and higher compatibility across wafer formats. In the latest TaiyangNews Market Survey on Cell Production Equipment 2025.
Leadmicro has provided data for 3 models, adding 2 of its latest tool sets – XH10000B and XH10000A– to the previously listed XH10000P. XH10000B is configured for boron diffusion and oxidation processes. It supports wafer sizes from M0 to G12, and also the larger 230 mm side length, with thicknesses between 140 and 220 μm. The system uses 6 process tubes, a horizontal wafer loading, and operates with air and water cooling. It has a system uptime of 95%, a mechanical yield of 99% and a power consumption of 152 kWh per hour.
XH10000A is designated for annealing applications. It features the same general hardware configuration as the other models: 6 tubes, air and water cooling, and horizontal handling for wafers sized up to 230 mm. System uptime is rated at 98%, with a mechanical yield of 99%, and power consumption is given as 152 kWh per hour.
XH10000P, a model launched in 2023, is also promoted for POCl diffusion. The system, integrated with 6 tubes, can process either 6,060 M10 or 5,300 G12 wafers per hour using horizontal loading. It has a rated mechanical yield of 98%.