The QP950 series wafer slicer, compatible with ultra-thin wires, can slice different wafer sizes from a brick measuring up to 950 mm in length
It can maintain a stable slicing operation at a wire speed of up to 45 m/s
Using this tool, M10 wafer thickness has been reduced up to 45 µm in laboratory conditions
The PV industry is increasingly adopting different wafer sizes to meet module dimensions for multiple application scenarios. To keep up with this evolving trend, wafer slicing tool makers are innovating with modular tools.
During the TaiyangNews Solar Technology Conference India 2025 (STC.I 2025), Zhixin Li, CEO & CTO of Linton Technologies Group and Linton Crystal Technologies, highlighted the company’s latest N-type QP950 ultra-thin wafer slicer
QP950 Wafer Slicer
Linton’s QP950 wafer slicer offers multiple advantages, including large loading capacity, ultra-thin wafer slicing, low wire consumption, ultra-thin wire compatibility, and high speed. Its performance can be evaluated across 3 key categories: high yield, speed, and compatibility.
High Yield
The QP950 supports brick lengths of up to 950 mm and is compatible with ultra-thin wires ranging from 16 µm to 18 µm. It can slice various wafer sizes, from 182 mm and 210 mm half-wafers to 230 mm full wafers, with a wire mesh length of 1,050 mm. The tool ensures stable slicing of full 950 mm bricks by minimizing wire breakage risk. Additionally, the system incorporates a 3-roller configuration and an integrated roller motion control algorithm, which helps eliminate wire bowing and significantly shortens slicing time, explained Dr. Li.
Modularity
Thanks to its multi-adjustable roller distance system, the QP950 is fully compatible across a range of wafer sizes, as mentioned above. Once the roller distances are set, its precisely engineered fixed-gear mechanical structure ensures the rollers maintain high accuracy, allowing consistent slicing across different wafer dimensions, Dr. Li noted.
Recommended roller distances for specific wafer sizes are provided in the accompanying table.
Speed
The stability of the system at speeds of up to 45 m/s ensures reduced wire consumption without any breakage, according to Dr. Li. This cutting speed is supported by Linton’s advanced wire management system and spindle box technology, according to Dr. Li.