Linton’s new QP950 series wafer slicer can process wafers of different sizes, such as M10, G12, and half, at a speed of up to 45 m/s. (Photo Credit: Linton Technologies) 
Technology

Precision Meets Speed: Linton’s QP950 Series Wafer Slicer

The leading Chinese wafer slicing tool supplier presented details of its modular tool platform at the TaiyangNews STC.I 2025

Rajarshi Sengupta

  • The QP950 series wafer slicer, compatible with ultra-thin wires, can slice different wafer sizes from a brick measuring up to 950 mm in length 

  • It can maintain a stable slicing operation at a wire speed of up to 45 m/s 

  • Using this tool, M10 wafer thickness has been reduced up to 45 µm in laboratory conditions

The PV industry is increasingly adopting different wafer sizes to meet module dimensions for multiple application scenarios. To keep up with this evolving trend, wafer slicing tool makers are innovating with modular tools.  

During the TaiyangNews Solar Technology Conference India 2025 (STC.I 2025), Zhixin Li, CEO & CTO of Linton Technologies Group and Linton Crystal Technologies, highlighted the company’s latest N-type QP950 ultra-thin wafer slicer  

QP950 Wafer Slicer 

Linton’s QP950 wafer slicer offers multiple advantages, including large loading capacity, ultra-thin wafer slicing, low wire consumption, ultra-thin wire compatibility, and high speed. Its performance can be evaluated across 3 key categories: high yield, speed, and compatibility. 

High Yield 

The QP950 supports brick lengths of up to 950 mm and is compatible with ultra-thin wires ranging from 16 µm to 18 µm. It can slice various wafer sizes, from 182 mm and 210 mm half-wafers to 230 mm full wafers, with a wire mesh length of 1,050 mm. The tool ensures stable slicing of full 950 mm bricks by minimizing wire breakage risk. Additionally, the system incorporates a 3-roller configuration and an integrated roller motion control algorithm, which helps eliminate wire bowing and significantly shortens slicing time, explained Dr. Li.

Modularity 

Thanks to its multi-adjustable roller distance system, the QP950 is fully compatible across a range of wafer sizes, as mentioned above. Once the roller distances are set, its precisely engineered fixed-gear mechanical structure ensures the rollers maintain high accuracy, allowing consistent slicing across different wafer dimensions, Dr. Li noted. 

Recommended roller distances for specific wafer sizes are provided in the accompanying table. 

Linton Technologies has recommended roller distances for specific wafer sizes. Photo Credit: (Linton Technologies)

Speed 

The stability of the system at speeds of up to 45 m/s ensures reduced wire consumption without any breakage, according to Dr. Li. This cutting speed is supported by Linton’s advanced wire management system and spindle box technology, according to Dr. Li.