

As India accelerates toward its target of 500 GW of non-fossil fuel capacity by 2030, the domestic solar manufacturing sector is undergoing its most critical transformation. Building massive module assembly capacity is no longer enough. To achieve true self-reliance and global competitiveness, India must master the entire upstream supply chain—from crystallization to high-reliability modules.
The 3rd TaiyangNews Solar Technology Conference India (STCI 2027) is the definitive technical summit where leading solar manufacturers, upstream technology suppliers, and quality experts meet to architect the next phase of Indian PV manufacturing.
Date: Jan 20 – 21, 2027
Time: 09:00 AM
Location: New Delhi, Delhi - India
Here is why STCI 2027 is an unmissable event for your technical, operational, and strategic teams:
The next frontier of Indian solar manufacturing lies in domestic ingot and wafer production. STCI 2027 provides an exclusive, high-level overview of crystallization technologies, diamond wire sawing, and wafer thickness optimization. Learn how leading players are overcoming the steep entry barriers to ingot casting and wafering to secure their raw material pipelines.
As cell technologies transition rapidly toward N-type architectures (TOPCon, HJT, xBC), manufacturing excellence is defined by two metrics: maximizing cell efficiency while driving down processing costs. Our technical sessions deep-dive into:
High-Yield Cell Lines: Optimizing metallization, reducing silver consumption, and advanced passivation techniques.
The Efficiency Frontier: Practical roadmaps for scaling TOPCon, deploying HJT, and the commercial viability of Back Contact (xBC) technologies in India.
Cost-Down Strategies: Minimizing utility consumption (electricity, water, gases) and chemical costs on the gigawatt scale.
A solar plant is only as reliable as its weakest module. With India's diverse and extreme climatic conditions—ranging from desert heat to high coastal humidity—ensuring long-term field performance is paramount. STCI 2027 addresses critical aspects of module engineering:
Advanced Components: Selection criteria for high-quality encapsulants (POE/EPE), ultra-reliable backsheets, and durable glass.
Failure Prevention: Mitigating Potential Induced Degradation (PID), Light and Elevated Temperature Induced Degradation (LeTID), and cell micro-cracks.
Testing & Metrology: Inline quality control, advanced electroluminescence (EL) imaging, and rigorous laboratory stress-testing.
We bypass high-level market summaries to bring you direct technical intelligence from the world’s leading equipment makers, material suppliers, and scientific minds. Get answers to your specific manufacturing bottlenecks directly from the engineers who design the production lines.
Whether you are upgrading an existing M10 multi-busbar line, setting up a greenfield TOPCon cell plant, or evaluating a joint venture for wafer manufacturing, STCI 2027 delivers the precise technical benchmarks and regulatory updates (including ALMM and PLI frameworks) you need to de-risk your investments.