On March 24th, the 2026 International Electronic Circuits (Shanghai) Exhibition, themed "PCB+AI: The Next Generation of Packaging," grandly opened at the Shanghai National Exhibition and Convention Center. This year's exhibition focused on the technological iterations in the electronic circuit industry, including AI, advanced packaging, glass substrates, and miniaturized manufacturing, as well as cutting-edge technologies and innovative solutions driven by intelligent vehicles and high-performance computing.
As a leading enterprise deeply rooted in the dry film field for PCB and semiconductor packaging, Hangzhou Foster Electronic Materials Co., Ltd. (hereinafter referred to as "Foster Materials") made a stunning appearance with its full range of core dry film photoresist products, independently developed high-frequency and high-speed substrates, and photosensitive cover films. With its core technological strength and customized solutions, Foster Materials became the focus of the exhibition, attracting numerous industry customers, partners, and experts to stop and exchange ideas, fully demonstrating its innovative accumulation and market influence in the field of dry film materials.
As AI computing power enters a race-for-speed era, every leap in computing power relies on breakthroughs in core materials. Foster Materials, focusing on electronic circuit innovation, has launched a groundbreaking dry film solution for ultra-high cover hole technology in the Tenting process of AI servers. Leveraging its robust R&D capabilities, Foster Materials helps solve pain points in high-end manufacturing processes. How is Foster Materials empowering a new future for AI server manufacturing through materials technology?
At the exhibition, Foster Materials showcased its series of dry film products developed for high-end semiconductor packaging applications, attracting widespread attention. The FD-800 series is specifically designed for semiconductor packaging substrates such as BGA and CSP! Its high sensitivity and high resolution, combined with small bottom traces and minimal plating contamination, make it perfectly suited for fine-line etching and mSAP processes, enabling more efficient high-precision manufacturing.
In addition to dry film, Foster Materials' independently developed adhesive-free flexible copper clad laminate is also very eye-catching! Using PI/TPI/MPI as insulating materials, it has high peel strength, excellent dimensional stability and heat resistance, and can be used to manufacture high-precision flexible circuit boards as well as high-frequency and high-speed circuit boards for 5G communication.
This exhibition highlighted the FH-30 series matte black photosensitive protective film developed specifically for mini LED/micro LED, the yellow photosensitive cover film for high-bend-resistance flexible circuit boards, and the FH-42 series green solder resist dry film for IC carrier boards. These films replace traditional ink screen printing, offering higher reflectivity, flatness, and resolution, providing crucial material packaging assurance for customer product upgrades.
Hangzhou Foster Electronic Materials Co., Ltd., as a specialized and innovative enterprise in the electronic materials field, has always taken innovation as its core driving force, focusing on the research and iterative upgrading of key materials such as dry film photoresists, photosensitive cover films, and high-frequency, high-speed substrates. The company continuously increases its R&D investment, builds a comprehensive technology R&D system, overcomes many key core technologies, and breaks down industry barriers. Its products boast excellent performance and are widely used in semiconductor packaging, PCB and FPC manufacturing, winning high recognition from customers at home and abroad with stable quality and professional service.
This appearance at the Shanghai CPCA exhibition serves as a crucial window for Foster Electronics to showcase its core products and demonstrate its technological strength. It also provides a valuable platform for connecting with industry resources, gaining insights into market trends, and deepening supply chain cooperation. Moving forward, Foster Electronics will focus on key materials such as dry film photoresists for semiconductor packaging, photosensitive cover films, and high-frequency, high-speed substrates. The company will refine its products, upgrade its services, and launch superior solutions to empower the global electronics manufacturing industry, contribute to its high-quality development, and write a new chapter in electronic materials innovation.
