German PV production equipment producer 3D-Micromac AG has introduced a new advanced laser cutting system for half- and shingled solar cells calling it the microCELL MCS, and claims it would enable higher module output and service life while bringing down power losses.
The company said it enables the highest throughputs for cutting cell sizes up to M12/G12 into half-cells or shingled cells. It has a superior productivity of more than 6,000 wafers an hour, 3D-Micromac explained, and is suitable for solar cells with temperature sensitive coatings or depositions as heterojunction (HJT) cells.
The new system uses company's own patented thermal laser separation (TLS) process to separate cell which give up to 30% higher mechanical strength compared to ablative laser processes, enabling lower power degradation over the module's working life.
Launching the product at Intersolar Europe Restart in Munich, Germany, 3D-Micromac's CEO Uwe Wagner called the microCELL MCS laser system a 'future-proof production solution' for module manufacturers that can fit into an intelligent and scalable cell production line. "The system can be upgraded with additional lasers with minimal effort to enable a higher number of cuts per wafer without compromising on throughput," added Wagner.
It has already sold 2 of these systems to compatriot solar module maker Hecker Solar GmbH for its production facilities in Thuringia and Chemnitz (see 400 MW Solar Fab Online In Germany).
The news follows Fraunhofer ISE and M10 Industries launching a new stringer machine to manufacture novel matrix shingle modules, also unveiled at the Intersolar Europe (see New Stringer For Shingle Modules).
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