Key takeaways:
Jinchen’s auto-bussing system uses non-contact induction soldering to connect cell strings within the module stack
The tool supports wafer sizes up to 230 mm and string spacing between 1 mm and 6 mm for modules up to 2,600 × 1,450 mm
A standard bussing cycle requires about 16 seconds, with additional time required for optional processes such as laser scraping
Another auto-bussing tool in the TaiyangNews Market Survey on Solar Module Production Equipment 2026 is from Jinchen. Similar to other toolmakers, Jinchen also uses non-contact induction soldering. With a standard setting of processing the 182 mm wafer type and 16BB, the tool is designed to process wafer sizes up to 230 mm. The tool can support a string spacing window of 1 to 6 mm, with a maximum module size of 2,600 × 1,450 mm.
Although the company doesn’t specify the throughput, a single process cycle requires a standard time of 16 s, plus 2 s for optional functions such as laser scraping of busbar coating. Jinchen claims a process yield of at least 99.5% and a mechanical yield of more than 99.999% for this tool, indicating a very low breakage. The bussing process achieves a minimum peel strength of 5 N/mm. The tool system offers busbar cutting and bending accuracy with a deviation of 0.4-0.5 mm, and an angular deviation of 2°. The system weighs 8 tons and measures 4,874 × 4,690 × 2,585 mm.
The text is an edited excerpt from TaiyangNews’ latest Market Survey on Solar Module Production Equipment 2026, which can be downloaded for free here.
