Betterial Highlights Specialized PV Films At SNEC 2026

The company presented encapsulation solutions for advanced module technologies and specialized applications at SNEC 2026
Betterial showcased encapsulation solutions for perovskite, BC, and TOPCon modules at SNEC 2026.
Betterial showcased encapsulation solutions for perovskite, BC, and TOPCon modules at SNEC 2026. (Image Credit: Betterial)
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Key Takeaways
  • Betterial showcased a TPO film designed for low-temperature processing of perovskite modules

  • Its film for BC modules uses an ultra-low-flow formulation designed to reduce silver-paste consumption

  • The company offers HC806 light-conversion film for application-specific scenarios

Chinese encapsulation material supplier Betterial presented application-specific encapsulation solutions for perovskite, back-contact (BC), and TOPCon modules at SNEC 2026. The company also showcased its HC806 light-conversion film for modules deployed in high-UV environments.

For perovskite modules, Betterial presented a thermoplastic (TPO) encapsulation film designed for low-temperature lamination. According to the company, its halogen-free formulation helps avoid the risk of chemical corrosion of the perovskite layer caused by halide residues generated by conventional crosslinked films. Betterial says the film enables low-temperature lamination while maintaining strong adhesion between the module layers. The company offers 2 modules for perovskite modules: the B606L high-transmittance film and the B606LP UV-cutoff film. Both offer light transmittance of at least 85% between 380 nm and 1,100 nm and adhesion to glass of at least 80 N/cm. B606L has UV transmittance of at least 75%, while B606LP limits UV transmittance to 10% or less.

For BC modules, Betterial offers an encapsulation film using an ultra-low-flow formulation. The film is designed to resist damp-heat aging, yellowing, and potential-induced degradation (PID). According to the company, it also supports lower silver paste consumption.

Betterial also showcased a high-transmittance encapsulation solution for TOPCon modules. According to the company, the film improves light transmission and photon utilization and is designed to resist UV exposure and long-term aging.

Along with the solutions for advanced technology, the company also presented encapsulation film for application-specific scenarios. For modules used in deserts, plateaus, and other high-UV environments, Betterial presented its HC806 light-conversion film. The film converts UV light into visible light with more than 95% efficiency. Betterial claims a module power gain of 1.2% to 3%. The company also reports less than 3% degradation after UV60 aging and says the film helps mitigate ultraviolet-induced degradation (UVID) and PID-related performance losses.

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