HIUV Taking Module Encapsulation Solutions To India With Local Manufacturing

Jitin Rai Khanna said the Chinese manufacturer will collaborate locally to serve the Indian market
HIUV
HIUV’s Jitin Rai Khanna picked EPE + EVA as the optimal encapsulant combination for TOPCon technology. (Photo Credit: TaiyangNews)
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The Global Sales Director of specialty polymer manufacturer HIUV Jitin Rai Khanna’s presentation at the TaiyangNews High Efficiency Solar Technologies 2024 conference started with the announcement of the company expanding its manufacturing footprint to India. HIUV is expected to establish cooperation with local partner in India in 2025 to serve the local market.  

At the conference, Khanna talked about HIUV’s module encapsulation solutions for TOPCon based on the various tests it conducted. It is the co-extruded EPE films that are becoming the standard and these do away with the need for any additional padding on the edges, achieving a lamination yield of up to 100%, according to Khanna.  

Additionally, dual-glass EVA solutions reduce costs and increase efficiency. However, for TOPCon solar cell encapsulation, Khanna considers the combination of EPE and EVA as the most optimized one, both from a cost and a performance point of view.  

At the conference, Khanna also introduced the company’s new co-extrusion EXP film-P507S product that brings cost benefits through reduced use of POE and also provides stable performance. 

For more presentation videos and conference summaries for all 4 days of the TaiyangNews High Efficiency Solar Technologies 2024 Conference, click here for days 1 and 2, and here for days 3 and 4.

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