Key takeaways:
DKEM’s showcase at SNEC included metallization pastes for TOPCon, BC, and HJT cell manufacturing
The portfolio includes silver, silver-nickel, silver-coated copper, and pure copper paste technologies
The company also showcased moisture-resistant butyl sealants for PV module encapsulation
DKEM, a China-based metallization paste maker, presented its latest product offerings at SNEC 2026. The product portfolio is classified by cell technology and includes low- and zero-silver consumption metallization solutions.
For TOPCon technology, DKEM presented its DK72E, DK95E, and DK82E pastes, each offering a specific advantage. DK72E is compatible with LECO and supports ultra-fine screen openings below 5 µm. DK95E supports metallization for rear-side polyfinger technology. DK82E is typically used for busbars in mainstream TOPCon cell manufacturing. The company also offers silver pastes for the fingers and busbars of back-contact (BC) cells.
For low-silver metallization, DKEM offers silver-nickel and silver-copper pastes, with pure copper paste solutions also available. The company says its DK95M silver-nickel paste is already used by several TOPCon players in commercial cell manufacturing. The technology is also optimized for BC manufacturing and is heading for commercialization by BC players.
Under copper-based silver pastes, which typically follow silver-coated copper paste technology, DKEM promotes DK61F for heterojunction (HJT) cells, with silver content ranging from 50% of the paste to as low as 10%.
The company also introduced a paste combination for TOPCon, in which a seed-layer silver paste, DK95S, is applied first, followed by a high-copper paste (silver-coated copper), DK62T, on top. The metallization with this combination is carried out in two firing steps after the application of seed and top layers. At its SNEC 2026 booth, the company exhibited TOPCon modules based on this combination, claiming that the solution has already achieved large-scale production at its customers' sites. However, it did not quantify silver consumption or reduction using this method.
A key showcase at the exhibition was its pure copper paste. The company also displayed TOPCon and BC modules made with cells using pure-copper-paste metallization.
Additionally, DKEM offers products to address reliability issues in PV modules, including a moisture-resistant butyl sealant with a low water vapor transmission rate and other advantages. The sealant is available in 3 physical forms: drum-packaged, as adhesive tape, and preformed gaskets.
