Key takeaways:
Gaoce showcased an integrated portfolio combining wafer processing equipment, consumables, and manufacturing services at SNEC 2026
The GC-800XC diamond wire slicing machine supports multiple wafer formats with low dynamic wire tension during operation
The company complements its equipment business with diamond wire consumables, wafer supply, and contract wafer slicing services
Gaoce Technology, one of the leading silicon wafer making companies based in China, showcased its products and services at SNEC 2026 in Shanghai. The company launched its integrated smart manufacturing solution of thin silicon wafers, in which equipment, process consumables, and process technologies are combined in a closed-loop system.
One of its key pieces of equipment on display was the GC-800XC diamond wire slicing machine, which supports slicing of multiple wafer specifications of 182 mm and 210 mm, and is also compatible with half wafer slicing. Launched in November 2024, the tool has a gear wheel base mode that ranges from 315-370 mm for 182 mm wafers and between 400 mm and 455 mm for 210 mm wafers. The maximum ingot loading capacity of the tool is 950 mm, and it operates with a dynamic wire tension of less than 0.8 N. This, according to the company, reduces the wire breakage rate to <5%. The maximum wire speed during operation is about 2,600 m/minute. The physical footprint of the equipment is 5,110 × 2,481 × 3,275 mm, and it weighs about 12,500 kg.
On the consumable side, the company offers 14 μm, 16 μm, and 18 μm fine tungsten diamond wires, among others. According to the company, the latter two are in mass commercial production, while the former 14 μm is currently under evaluation for commercial offering.
One of the significant services that Gaoce offers is its ‘asset cooperation’, in which the company provides its 70 GW wafer-slicing facility to its customers without requiring them to invest in upstream manufacturing. The company also supports complete wafer production turnkey line solutions for international customers.
On the supply side, Gaoce offers mainstream formats, including 210 mm and 183.75 mm n-type wafers, in full- and half-cut configurations.
