Key takeaways:
Gapless and full-screen module designs increase active area, contributing to higher module power output
Film insertion between overlapping cells helps reduce mechanical stress and lowers the risk of edge cracking
Zero-busbar technology is gaining traction as manufacturers seek to reduce silver consumption and simplify cell interconnection
In module assembly, apart from the multi-cut trend that has emerged over the last 1 year, other important developments that cannot be ignored include gapless, full-screen modules, and zero-busbar (0BB) modules. The former is achieved during the interconnection process by laying out cells in an overlapping configuration. This is also compatible with the multi-cut approach. However, such a layout increases the mechanical stress at the cells’ edges. To address this, companies are inserting a film in the overlapping area of the 2 adjacent cells. This reduces stress and the risk of edge cracking during lamination, thereby improving overall mechanical stability. Leading module production equipment makers are offering tools that can support both gapless interconnection and film insertion.
Full-screen (FS) design is yet another important trend at the module level. It is all about hiding the string interconnecting ribbons on the rear side of the modules. Similar to the narrow bezel designs seen in modern smartphones, the FS layout increases the module’s active area by reducing inactive margins. The combination of gapless and FS results in a power gain of 7-8 W, according to JA Solar. These 2 approaches are also part of the power update package for the company’s DeepBlue 5.0. However, they are not limited to TOPCon; the technology pack has also been adopted in several BC modules.
0BB technology attracted significant attention in 2025, with nearly every leading supplier introducing a module based on it and showcasing it at major solar trade shows. The key motivation is to reduce costs, especially by reducing silver consumption. The beauty of the 0BB technology is that it enables the interconnection of cells with no busbars, which are typically silver-based. The technology was primarily developed for HJT, but evaluated by all technology platforms.
The text is an edited excerpt from TaiyangNews’ report on Cell & Module Technology Trends 2026, which can be downloaded for free here.
