Key takeaways:
The IndiFiduell project aims to develop scalable interconnection methods for IBC, TOPCon, and perovskite-silicon tandem modules with reduced silver usage
A new laboratory-tailored stringer supports soldering and ECA bonding, along with multiple cell sizes and busbar configurations
The consortium targets demonstrating cost-reduction potential and establishing a path toward industrial-scale manufacturing tools
As part of the IndiFiduell research project, Mondragon Assembly has delivered a new cell-interconnecting stringer machine to ISC Konstanz. The project is funded by the German Federal Ministry for Economic Affairs and Energy. There are several partners involved in this project, including Fraunhofer CSP, Henkel AG & Co. KGaA, Tamura Elsold GmbH, Qcells, Mondragon Assembly GmbH, and ISRA Vision GmbH. The project aims to develop a cell interconnection method for modules based on n-type interdigitated back-contact (IBC), TOPCon, and perovskite-silicon tandem modules, while also minimizing the use of silver in cell metallization and interconnection. According to ISC Konstanz, this is achieved through a novel, lead-free interconnection approach using individual wire-finger contacts, which is compatible with high-throughput stringing processes.
One of the key objectives of this project is to develop and demonstrate a tool that can be scaled up to industrial manufacturing. This also involves demonstrating more than 6% cost-reduction potential for IBC and perovskite-Si tandem modules.
The stringer is tailored for laboratory applications and can support soldering as well as electrically conductive adhesive (ECA) bonding. The tool is claimed to support various cell sizes, ribbon geometries, and busbar configurations, including zero-busbar (0BB) IBC cells, with modular upgrades. In collaboration with Mondragon and other partners, ISC plans to develop a flexible, cost-effective solution for high-performance cell interconnection.
