Leadmicro extends its process portfolio beyond plasma-based PECVD and PEALD by launching LPCVD equipment for TOPCon manufacturing
The XH10000LP uses a 6-chamber batch configuration supporting up to 2,880 M10 or 2,200 G12 wafers, with throughput reaching 9,425 wafers/hour
The system operates between 440 and 700°C and reaches a 90% uptime
Leadmicro, a strong advocate of plasma-based deposition processes such as PECVD and PEALD, has also started offering LPCVD systems. The XH10000LP represents the company’s LPCVD offerings tailored for tunnel oxide and in-situ doped polysilicon deposition in TOPCon solar cell production. It supports a wide range of wafer sizes, from M0 to G12, and thicknesses of 130 to 220 μm.
The platform uses a 6-chamber batch processing configuration with quartz or silicon carbide boats, supporting automatic wafer loading. The tool accommodates 2,880 wafers per boat of M10 and 2,200 of G12 formats. The system operates across a temperature range of 440 to 700°C, with process pressures ranging from 20 to 45 Pa. Film thicknesses typically range from 1 to 2.5 nm for oxide and 90 to 300 nm for polysilicon.
This LPCVD tool reaches a maximum throughput of 9,425 wafers/hour, with an average of 8,482 wafers/hour depending on wafer size. The cleaning regime for the tool involves chemical methods at 3-month intervals, with a chamber cleaning time of 12 hours. It consumes 135 kWh/h of power and 0.76 liters of water per wafer. The system achieves an uptime of 90% and a mechanical yield of 95%. The platform offers flexibility to switch between vertical and horizontal for wafer orientation during the process.
The text is an edited excerpt from TaiyangNews’ latest Market Survey on Solar Cell Production Equipment 2025, which can be downloaded for free here.
