Bo Jin, Senior Marketing Manager at Hangzhou First, discussed encapsulation techniques that can reduce costs while maintaining solar module reliability. Jin highlighted key failure modes in TOPCon modules, including damp heat-induced corrosion, potential-induced degradation (PID), and ultraviolet-induced degradation (UVID). For glass-to-glass TOPCon modules, Jin said POE or EPE encapsulants on the front side offer a premium solution. For glass-to-backsheet designs, Hangzhou First recommends its TF4N POE on the front, combined with low-acid EVA and a conventional backsheet on the rear. To address UVID, manufacturers can consider UV-cutoff or UV-conversion films. He also highlighted advanced encapsulation solutions for TOPCon designs, including zero-busbar (0BB), ultra-narrow-edge, and multi-cut cells, as well as insulating and protective inks for back-contact (BC) modules.