RENA Technologies, a leader in wet processing for PV, has launched the InEtchSide, a high-throughput single-side etching system during Intersolar. Based on the newly developed NIAK4 machine platform, the InEtchSide performs rear side oxide etching and single side SiO2 or glass removal in a dry-to-dry inline process. It is suitable for the manufacturing of high-efficiency solar cells with TOPCon, IBC, or PERC technology, and eliminates production bottlenecks with its singletool solution. The integrated Fast Etch Technology and 12-lane layout enable a gross throughput of up to 14,000 wafers per hour, depending on the wafer format. The InEtchSide was designed with the goal of creating a more efficient and fully automated tool with a small footprint. It also offers the benefits of a long process bath lifetime and high uptimes, which help reduce manufacturing costs.
Given that the photovoltaic market is transitioning towards advanced cell technologies and various wafer sizes, it is crucial to have adaptable tools that can meet these diverse requirements. The InEtchSide can be used with different cell technologies such as PERC, TOPCon and IBC as well as wafer sizes ranging from M0 to M12. The optimal utilization of the InEtchSide tool within the production line depends on the specific cell technology employed by the customer.
In the future, RENA plans to enhance its inline tools by introducing an automated loading and unloadingsystem. This system will further contribute to offering a convenient and comprehensive solution for solar cell manufacturing (see Alkaline Chemistry For Wafer Etching).
The text is an excerpt from TaiyangNews New Solar Products Overview H1/2023, which can be downloaded for free here.
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