Risen Energy Showcases HJT Product Line At SNEC 2024

Company’s 'Hyper Ion' 750 W+ HJT Module Takes Centerstage At The Event
Breaking the limitation: Risen's latest displayed 767.38 W HJT model at SNEC 2024, underscores the successful technological advancement in 'Hyper-ion' HJT cell technology. (Photo credit: TaiyangNews)
Breaking the limitation: Risen's latest displayed 767.38 W HJT model at SNEC 2024, underscores the successful technological advancement in 'Hyper-ion' HJT cell technology. (Photo credit: TaiyangNews)
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Risen Energy, a vertically integrated photovoltaic (PV) manufacturer, and a heterojunction (HJT) cell technology advocate, recently exhibited its latest product offerings at SNEC 2024 in Shanghai. The Zhejiang-headquartered company has 40 GW+ cells and 48 GW+ module manufacturing capacity in 8 locations.

Speaking to TaiyangNews during the event, the company highlighted the latest addition to the ‘Hyper-ion’ HJT module series. The aluminum-framed new HJT model in 132 pieces of G12 size half-cells in a module dimension of 2,384 x 1,303 x 33 mm, yields a power output of up to 767.38 W+ and an efficiency of 24.7%. This model is also available in a steel frame in dimensions of 2,384 x 1,303 x 35 mm, added the company. Risen Energy says that the displayed lab-scale 767.38 W capacity bifacial HJT model achieved an average mass-production wattage of 720 W and an efficiency of 23%, marketed under the RSM132-8-700-725BHDG series. Its high power and efficiency can be attributed to Risen Energy’s technological progress at both the HJT cell and module levels.

Cell-level advancements

By adopting the half-ingot cutting process, the progression in cell technology starts from the wafer level. Risen explained that the ingot half-cutting technique applied prior to cell processing reduces cutting losses by 0.1% to 0.2% by minimizing damage to the cell’s passivation and protective layers during the laser-cutting phase. On the other hand, the reduction of wafer thickness to 90 µm enhances the cell’s mechanical flexibility and optimizes cell production cost. This improved mechanical cell flexibility mitigates the risk of hidden microcrack generation in the module. The company noted that the latest ultra-thin HJT cell comes without any printed busbar.

Module-level advancements

The crux of the latest HJT module lies in the innovative Hyper-ion busbarless (0BB) cell interconnection technology. In this patented interconnection technology, silver-free soldering ribbons are glued over the cell surface by an adhesive tape or paste in a low-temperature process of less than 200℃. This results in savings in silver consumption of less than 7 mg/W and a stress-free interconnection process mitigating the risk posed by conventional HJT welding processes like corrosion due to flux residue, soldering ribbon dislocation during hotspots due to low melting point solder, added the company. On the other hand, the Hyper-ion technology boosts module wattage due to less shading by the thinner ribbon, higher current density for more contact points of soldering ribbon, and higher conductivity. These key features contribute to achieving improved CTM losses. In the recently concluded TaiyangNews ‘Technology Trends in H1 2024’ annual virtual conference, Risen Energy noted the 0BB HJT cell’s best batch average efficiency of 25.8% (see Risen Energy’s presentation here).

According to Risen Energy, the Hyper-ion series HJT modules have achieved a 4 GW global shipment level till now.

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