Singulus highlighted its latest high-volume batch-type wet processing (SILEX III) equipment compatible with up to G12 or G12 HC size wafer
The tool maker offers a horizontal inline high-throughput GENERIS series PECVD tool, for core layer deposition on up to G12 or G12 HC size wafer
Singulus also offers the horizontal inline GENERIS series PVD vacuum sputtering tool, having up to 1 GW annual throughput, for double-sided TCO layer deposition
The ongoing effort to reduce the cost gap between TOPCon and HJT, the 2 mainstream n-type cell technologies today, involves multiple optimization pathways, including material costs, equipment capacity, and overall efficiency. In addition to lowering production costs through technological advancements and material optimization, increasing the capacity of production tools offers significant potential for further reducing the cost of HJT mass production, which involves fewer process stages than TOPCon.
At the recent TaiyangNews annual flagship event, High-Efficiency Solar Technologies 2024, Jan Krausmann, Product Manager for Solar at Singulus Technologies AG, provided a brief overview of the company's latest high-capacity HJT cell production tools (see Singulus Technologies presentation here). Singulus Technologies AG, headquartered in Germany, is a leading supplier of production tools for vacuum and wet process applications, catering to various markets including photovoltaic (PV), medical technology, glass, automotive, semiconductor, battery, and hydrogen industries. Its product portfolio, based on different applications, includes technologies for Vacuum Sputtering, Plasma Enhanced CVD (PECVD), Evaporation/Sublimation and RTP, Wet Chemical Treatment, and Surface Refinement. Additionally, Singulus Technologies offers comprehensive HJT turnkey solutions.
Singulus Technologies manufactures equipment for key HJT process steps, including HJT wafer surface texturing, core layer deposition, and TCO layer deposition. The company also provides the latest passivated edge technology (PET) tool for half-cut cell edge passivation.
The SILEX III series batch-type wet chemical treatment tool is designed for texturing and cleaning wafers up to G12 or G12 half-cut sizes, with the capacity to deliver up to 1 GW of annual production. Compatible with thinner wafers, this tool boasts a low breakage rate of just 0.1%, processing over 8,000 G12-sized textured wafers per hour. For G12 half-cut wafers, throughput can exceed 14,000 wafers per hour. The tool features an in-house ozone system for cleaning and etching, enhancing efficiency and reducing the cost of ownership (COO). Additionally, the integrated advanced process control system helps conserve primary texturing media, extending bath life and further reducing COO. According to the company’s datasheet, the tool can achieve etch removal of less than 22 µm per wafer, while the reflectivity of the textured wafer surface can be reduced to 11% or below.
Singulus Technologies also offers the GENERIS series PECVD tool, a horizontal inline high-throughput solution for core layer deposition in 2 types of HJT cell structures: (i) a-Si:H / (n) a-Si:H / (i) a-Si:H / (p) a-Si:H and (ii) a-Si:H / (n) nc-Si-H / (i) a-Si:H / (p) nc-Si:H. Equipped with a tray return system (TRT) and RF-based static plasma source, this tool uses a linear dynamic deposition mechanism to deposit thin films with the required thickness. In a double-ended system, the number of plasma sources is determined by the required film thickness and cycle time. According to Singulus, the inline PECVD tool, with one tray and a cycle time of less than 45 seconds per batch, can achieve a throughput of over 7,600 wafers per hour for G12 wafers and more than 14,000 wafers per hour for G12 half-cut wafers. With more than 90% system uptime and a breakage rate of less than 0.1%, this tool utilizes integrated gas-based NF3 solutions for cleaning process.
For the deposition of a double-sided thin transparent conductive oxide (TCO) layer, Singulus Technologies offers the horizontal inline GENERIS series PVD vacuum sputtering tool without any vacuum breakage. This tool, equipped with a specially designed tray for horizontal wafer transport and an integrated tray return system, provides up to 1 GW of annual throughput for wafers up to G12 or G12 half-cut sizes. The deposition of the double-sided TCO layer is achieved using a rotatable cathode sputtering technique, the company notes.
To enhance the efficiency of HJT modules, the company offers a passivated edge technology (PET) tool to address the performance losses caused by the unpassivated edges of half-cut HJT cells. The GENERIS PET tool is available in 2 models: Standard and Advanced.
The GENERIS PET Tool (Standard), equipped with a fully automated tray loading and unloading mechanism and a unique tray design, can process up to 4,800 wafers per tray. It supports various cut formats, including ½ cut, ¼ cut, 1/6 cut, and 1/8 cut, with a cycle time of up to 20 minutes per tray.
The GENERIS PET Tool (Advanced) offers a higher throughput of 7,200 wafers per tray and a cycle time of just 6 minutes, supporting cut formats such as ½ cut, ¼ cut, and 1/6 cut.
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