

SOLYCO’s TECC wire is based on a Cu core, which is coated with a thin layer of Ag
This wire, with a melting point of 130°C to 180°C, is coated with an ECA adhesive and subsequently cured to complete the interconnection
This interconnection technology is suitable for perovskite tandem cell technology
SOLYCO Solar, a German PV module and solar system supplier, has developed a PV cell interconnection technology, TECC-Connect, that eliminates the use of Silver (Ag), Lead (Pb), and Bismuth (Bi). These raw materials are expensive, toxic, and difficult to scale. The company was named a finalist for this technology in The smarter E AWARD 2026 under the ‘Photovoltaics’ category.
According to the company, the TECC wire with a Cu core is coated with a thin layer of Ag. The latter prevents oxidation of the core. This core is subsequently coated with an electrically conductive adhesive, replacing conventional soldering processes. Thus, it enables the production of a PV module free of Ag, Pb, and Bi. The company claims that its low melting point, between 130°C and 180°C, compared to solder wire, makes it suitable for next-generation solar cells, such as perovskite tandems. SOLYCO added that this technology can also be used with a variety of cell technologies, whether they are based on standard Ag-based metallization or Cu/ Al alternatives.
This technology is patented by the company in the EU, the USA and China.