Cybrid’s listing now includes the latest POE-based films – T22, C22, and B22H – alongside its earlier coextruded models T22H and WT22H
All films feature a tensile strength of at least 5 MPa, elongation of 400% and adhesion strength of at least 60 N/cm
WT22H includes UV-light conversion technology for HJT modules, while coextruded T22H and WT22H combine EVA and POE
Cybrid, a leading supplier of backsheets and encapsulation materials, is featured in the 4th TaiyangNews Combined Market Survey with 5 non-EVA encapsulant products. The encapsulation section of the survey is categorized into EVA and non-EVA materials, and Cybrid contributes 3 new additions – T22, C22, and B22H – alongside its previously listed coextruded films T22H and WT22H.
The latest additions, launched in 2017 and 2022 respectively, are polyolefin-based films designed for applications such as glass-glass modules and advanced cell technologies like HJT. These polyolefin-based films exhibit similar physical properties, including a density of 0.88 g/ cm³. The first 2 are clear films, while B22H is a black variant. T22 features an embossed surface finish. All 3 films boast a tensile strength of ≥ 5 MPa, elongation of ≥ 400%, and shrinkage of ≤ 3% in both MD and TD directions. At ≥ 60 N/cm, they exhibit strong adhesive properties for both glass and backsheet materials. They operate at a lamination temperature of 145°C, with a vacuum time of 5 minutes and a press time of 10 minutes.
T22H and WT22H, featured in the 3rd market survey, remain unchanged. Based on coextruded film containing EVA and POE, these products bring the best of both worlds for glass-glass module makers. They also share most of the specs – ≥ 5 MPa tensile strength, 3% shrinkage, and 60 N/ cm adhesion to glass as well as the backsheet, while the 500% elongation for WT22H is slightly higher than the 400% for T22H.
At the TaiyangNews High Efficiency Solar Technologies 2024 Conference, Anurag Mishra, Senior Manager of Marketing at Cybrid Technologies, highlighted its proprietary RayBo film as a UV-light conversion solution designed for HJT and TOPCon modules (see Cybrid’s RayBo Film: Mitigating Module Level UVID).
WT22H, the 2022 model, has the same physical parameters as the 2017-launched T22H, but a slight difference can be observed in the performance characteristics and mechanical properties. The company offers clear variants of these fast-cure products with an embossed surface finish. Both products support a lamination temperature of 145°C and a cycle time of 20 minutes, and Cybrid recommends a vacuum time of 5 minutes and a press time of 10 minutes. With respect to the optical properties, light transmittance is rated at 91% between the wavelengths of 385 and 1,100 nm for T22H, and 90% for WT22H between the wavelengths of 380 and 1,100 nm.
The T22H coextruded encapsulant has the highest volume resistivity of ≥ 2 × 1016 Ω cm among the products listed in this section of the survey, while WT22H has 1 × 1016 Ω cm volume resistivity. The major difference between the 2 models is that the WT22H features UV-light conversion technology, specially designed for HJT modules.
For more details on Cybrid’s products, please refer to the product description section of the report, which outlines specifications for all non-EVA-based materials.
The text is an excerpt from the latest TaiyangNews Market Survey on Backsheets & Encapsulation Materials 2024/25, which can be downloaded for free here.