SNEC 2024 Exclusive: Tongwei Executive Interview

TaiyangNews & SNEC 2024 - Leadership Conversations With CTO – PV Business, Tongwei


The CTO of the PV Business at Tongwei, Guoqiang Xing, spoke exclusively to TaiyangNews during the SNEC Dialogue & Conference & Exhibition 2024 event in China as part of TaiyangNews & SNEC 2024 – Solar Leadership Conversations on June 15, 2024.

China’s Tongwei has been a prominent player in the silicon and cell manufacturing field, embarking on a significant journey to become a fully vertically integrated PV company. Discussing the latest trends and developments in the solar industry, Xing emphasized the rise of n-type silicon cell technology.

Xing shared that 2023 was a pivotal year for the industry, marked by the growing dominance of n-type silicon in polysilicon, wafer, cell, and module sectors. He highlighted that the industry has seen a rapid increase in the adoption of TOPCon (Tunnel Oxide Passivated Contact) technology, with capacities soaring from 800 GW to 900 GW. This expansion, he noted, largely occurred over the past 18 months.

The standardization of wafer and module sizes has also been a significant development. In July 2023, 9 major Chinese module manufacturers agreed on standardizing module sizes to streamline production, with 210 x 210 mm or G12 and 182 x 210 mm or G12R becoming the mainstream wafer sizes.

Another critical trend has been the reduction in silver usage for metallization. TOPCon technology has significantly reduced silver consumption, with figures dropping from 120 mg per M10 cell to around 80 mg. Looking ahead, the industry is moving towards silver-less technology, with Tongwei developing copper metallization to further cut costs.

Discussing the future of solar cell technology, Xing revealed Tongwei’s advancements in heterojunction (HJT) technology. Despite focusing on TOPCon for its current portfolio, it continues to invest in HJT R&D. Xing mentioned that their new state-of-the-art R&D center is working on various technologies, including HJT, TOPCon, interdigitated back contact (IBC), and perovskite tandem cells.

Xing emphasized that while HJT currently faces a cost disadvantage compared to TOPCon, the performance improvements and innovations in reducing silver usage could make HJT competitive in the future. He sees HJT modules achieving 30 W higher output than TOPCon modules soon, demonstrating significant potential.

When asked about the broader industry trends, Xing noted the growing importance of vertical and horizontal integration. He explained that vertical integration ensures cost advantages and supply chain security, while horizontal integration allows companies to offer comprehensive energy solutions, including storage and system components.

Looking forward to the rest of 2024, Xing predicted breakthroughs in copper interconnect technology for PV and significant advancements in HJT modules, potentially achieving 30 W higher output compared to TOPCon. He also foresees multiple technologies coexisting on the main stage, with n-type silicon continuing to lead the way.

Tongwei’s strategic focus on both R&D and practical applications positions the company at the forefront of solar technology innovation. With a clear roadmap and ongoing investments in cutting-edge technologies, Tongwei aims to continue driving efficiency and cost reductions in the solar industry.

Watch the full exclusive interview to learn more about Tongwei’s latest innovations and future plans.

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