Shenzhen S.C’s vertical batch-type diffusion furnace is optimized for boron diffusion in TOPCon cell manufacturing, supporting M10 to G12 wafer formats
Its dual-stack configuration includes 6 quartz tubes measuring 480 mm each, and tools achieve a throughput of up to 4,850 wafers per hour
It achieves a mechanical yield of 98% and an uptime of 96%
In the latest TaiyangNews Market Survey on Cell Production Equipment, Shenzhen S.C participated with one model in the diffusion furnace category. The listed system, DOA480L, is designed for boron diffusion processes used in TOPCon cell manufacturing and features a vertical batch-type configuration suited for high-volume production.
The system uses a dual-stack setup and includes 6 quartz tubes, each 480 mm in diameter. It is designed to handle wafer formats from M10 to G12 with thicknesses between 140 and 200 µm. With a pitch of 2.72 mm, it enables loading of up to 2,880 M10 wafers per tube. The complete system measures about 10.4 × 2.24 × 4.49 m and weighs 17,400 kg.
Operating at a typical temperature of 1,050°C, the DOA480L functions under low-pressure conditions of around 100 mbar. The sheet resistance distribution is given as 6% within a wafer, 6% between wafers, and 5% between batches. The standard process cycle takes around 13,500 seconds. The system achieves a maximum throughput of about 4,850 M10 and 3,700 G12 wafers per hour. In terms of performance, the furnace provides a mechanical yield of 98% and a system uptime of 96%.
