Shenzhen S.C offers 3 screen-printing platforms, covering standard, TOPCon-specific, and HJT-focused production lines
Throughput scales from 9,000 wafers/hour on the SCPT6800D to 16,000 wafers/hour on the SCPT-9000D-HJT-W for half-cut formats
The platforms integrate automated paste handling, AOI, IR drying, and multi-lane buffering, and are positioned for future copper-based metallization
Shenzhen S.C continues to expand its screen-printing portfolio, targeting higher throughput and technology-specific requirements for TOPCon and HJT solar cell production. In the latest TaiyangNews Market Survey on Cell Production Equipment 2025, Shenzhen S.C has expanded its offerings with updates across 3 platforms. SCPT6800D remains the baseline model for wafers sized 182 mm to 230mm, with a throughput of 9,000 wafers/hour.
SCPT-9000D-TOPCon-W is a dedicated high-throughput system for TOPCon manufacturing, featuring an 8-printer-per-lane setup and support for 182 mm wafers with a maximum throughput of 9,600 wafers/hour. The company has also provided tool specs for SCPT-9000D-HJT-W, a high-output solution for HJT lines that now delivers up to 16,000 wafers/hour(half-cut 182 × 91 mm format).
All 3 platforms feature automated paste handling, AOI, belt/horizontal IR drying, and multi-lane buffer support. Shenzhen S.C is aligning its equipment portfolio with future copper adoption strategies. At the 2024 TaiyangNews Production Equipment Conference, the company highlighted its turnkey printing lines, which are compatible with both silver and copper pastes. Future developments include copper plating solutions and hybrid paste applications.
