Milind S. Kulkarni, the company’s Chairman and CEO, says simulation, process control, and metrology will be essential as manufacturers produce larger and thinner wafers on existing equipment platforms
The company discussed encapsulation and insulation materials for 0BB, ultra-narrow-edge, and multi-cut modules, along with functional inks for BC and HJT cells
The company laid out its TOPCon roadmap and presented the developments in TBC cells at the TaiyangNews Cell & Module Production Equipment and Processing Materials Conference
The 17th edition of the ITRPV forecasts larger and thinner wafers, lower silver consumption, higher module efficiencies, and longer PV system lifetimes